The Next Generation of Hot Melt Adhesives for Case and Carton Sealing #1007

Mon. September 25| 10:00 AM - 10:30 AM | Innovation Stage | C-1045 PACK EXPO Las Vegas

A next generation, water-white, hot melt technology, Kizen revolutionizes case and carton sealing with improved performance over current adhesive solutions. Designed with attention to blocking and thermal stability, Kizen reduces downtime associated with clogged feed systems, thermal degradation and narrow application windows, improving production efficiencies and offering adhesive consolidation opportunities.

Type: Innovation Stage

Track: PACK EXPO Las Vegas Innovation Stage


Speakers

Schoenherr, Corey Business Development Manager - Packaging, Bostik | Role: Presenter